Package Design Rule Owner (dro)

Intel Foundry

Phoenix, Arizona, United States
Base: $141,910.00-269,100.00 usd; bonus/equity: st...
Hybrid
Package substrate physical design experience
Thermo-mechanical and electrical performance expertise
Substrate manufacturing and assembly process knowledge
The role involves defining and deploying design rules for package substrates from the earliest technology concept stages through product tape out

Job Summary

  • The role involves defining and deploying design rules for package substrates from the earliest technology concept stages through product tape out.
  • Candidates must possess US citizenship and the ability to obtain a TS/SCI Security Clearance with Polygraph.
  • Intel offers a competitive compensation package including stock bonuses, health benefits, and retirement programs.

Matching Summary

The role involves defining and deploying design rules for package substrates from the earliest technology concept stages through product tape out.

Salary

Base: $141,910.00-269,100.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • Package substrate physical design experience
  • Thermo-mechanical and electrical performance expertise
  • Substrate manufacturing and assembly process knowledge
  • Cross-organizational stakeholder collaboration

Nice-to-have

  • Expertise in EMIB and Foveros architectures
  • Strong analytical and problem-solving skills
  • Ability to work at various levels of abstraction
  • Self-motivated individual with strong organization

Key Requirements

  • US Citizenship required
  • Bachelor's degree in STEM field
  • 2+ years in semiconductor fabrication processes
  • 6+ years experience with Bachelor's or equivalent
  • TS/SCI Security Clearance eligibility

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter