Base: attractive salary based on current income; b...
On-site
Semiconductor materials development
Thermal interface material expertise
Precise measurement and sample preparation
TSMC Japan 3DIC Research and Development Center drives innovation in advanced semiconductor packaging technologies including CoWoS® for AI semiconductor modules
Job Summary
TSMC Japan 3DIC Research and Development Center drives innovation in advanced semiconductor packaging technologies including CoWoS® for AI semiconductor modules.
The role involves collaboration with Japanese suppliers and global teams to develop new materials and optimize thermal interface materials with cutting-edge measurement techniques.
Employees benefit from a supportive environment with opportunities for skill development, competitive salary, bonuses, and comprehensive social insurance and retirement plans.
Matching Summary
TSMC Japan 3DIC Research and Development Center drives innovation in advanced semiconductor packaging technologies including CoWoS® for AI semiconductor modules.
Salary
Base: Attractive salary based on current income; Bonus/Equity: Biannual bonuses plus annual performance bonus; Benefits: Commuting allowance, social insurance, retirement plans