Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies
Job Summary
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
Matching Summary
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Skills & Requirements
Must-have
Develops assembly processes and equipment
Optimize manufacturing efficiency
Develop process and equipment specifications
Evaluate silicon and package technologies
Ensures manufacturability of physical layout
Establishes material specifications
Develops new techniques and acceleration methods
Nice-to-have
Innovative solutions for future packaging
Fundamental understanding of failure mechanisms
Consultation concerning packaging problems
Continuous engagement with partner groups
Key Requirements
MSc/PhD degree in relevant engineering fields
At least 3 years of working experience
Fundamental understanding of semiconductor assembly equipment
Focus on thermal/fluid/packaging assembly process engineering