Advanced Defect Modeling and Testing Technical Manager
TSMC
Taiwan
Hybrid
Defect modeling for 2d and 3d structures
Spice simulation proficiency
Atpg tool expertise
TSMC is seeking an experienced Technical Manager for advanced defect modeling, testing, and analysis in semiconductor processes and 3D packaging technologies. This pivotal role involves developing methodologies to enhance defect identification and yield optimization, supporting the company’s commitment to innovation in the semiconductor industry
Job Summary
This role is strategically critical for TSMC to pioneer new approaches to defect modeling in advanced packaging.
The successful candidate will develop methodologies to model and simulate defects while optimizing testing strategies for next-generation processes.
Collaboration across design, process, test, and reliability functions is required to ensure the functionality and yield of advanced 2.5D/3D packaging technologies.
Matching Summary
Match Score: 85
TSMC is seeking an experienced Technical Manager for advanced defect modeling, testing, and analysis in semiconductor processes and 3D packaging technologies. This pivotal role involves developing methodologies to enhance defect identification and yield optimization, supporting the company’s commitment to innovation in the semiconductor industry.
Skills & Requirements
Must-have
Defect modeling for 2D and 3D structures
SPICE simulation proficiency
ATPG tool expertise
Python Perl C++ scripting
Root cause analysis of defects
Nice-to-have
AI/ML for defect prediction
Patent or publication contributions
Cross-functional collaboration skills
Thermal and mechanical considerations
Global stakeholder management
Key Requirements
Master's or Ph.D. degree in Computer Engineering or Semiconductor Physics
15+ years of expertise in failure mechanisms and defect physics
Proficiency with SPICE simulation tools like HSPICE or Spectre
Programming skills in Python, Perl, or C++
Deep understanding of DFT/ATPG methodologies for packaging