Thermo compression bonding (tcb) process optimization
Hbm, cowos, 2.5d, and 3d packaging experience
Troubleshooting bonding issues like voids and delamination
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The Senior Advanced Packaging Process Engineering position at The Supreme HR Advisory in Admiralty, Singapore, seeks an experienced engineer specializing in advanced semiconductor packaging techniques. The role involves engaging with customers on their packaging needs, optimizing processes, and troubleshooting equipment issues within the semiconductor industry.
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Job Summary
The role involves engaging semiconductor customers to understand packaging roadmaps and translate requirements into internal equipment specifications.
Candidates will lead machine qualification activities including FAT and SAT while supporting customer buyoff and onsite qualification processes.
The position requires developing and optimizing TCB process parameters for advanced applications such as HBM, CoWoS, and Chiplet Integration.
Matching Summary
Match Score: 75
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The Senior Advanced Packaging Process Engineering position at The Supreme HR Advisory in Admiralty, Singapore, seeks an experienced engineer specializing in advanced semiconductor packaging techniques. The role involves engaging with customers on their packaging needs, optimizing processes, and troubleshooting equipment issues within the semiconductor industry.
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Salary
Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) process optimization
HBM, CoWoS, 2.5D, and 3D packaging experience
Troubleshooting bonding issues like voids and delamination
Nice-to-have
Experience with fluxless or N2 bonding environments
OSAT or IDM industry background preferred
Strong statistical analysis and DOE skills
Key Requirements
Bachelor's or Master's degree in Materials Science, Mechanical, Electrical, or Semiconductor Engineering
5–15 years of semiconductor packaging experience
Hands-on experience in TCB, Flip Chip, and Advanced Packaging