Principal Engineer, Package Co-design

GlobalFoundries

Multiple Locations
Packaging and die-package co-design
Signal/power integrity expertise
Thermal and mechanical considerations
GlobalFoundries is a leading full-service semiconductor foundry

Job Summary

  • GlobalFoundries is a leading full-service semiconductor foundry.
  • The role requires deep expertise in different packaging technologies.
  • The position involves mentorship and leadership for junior engineers.

Matching Summary

GlobalFoundries is a leading full-service semiconductor foundry.

Skills & Requirements

Must-have

  • Packaging and Die-Package Co-Design
  • Signal/power integrity expertise
  • Thermal and mechanical considerations

Nice-to-have

  • Collaborative mindset
  • Experience with mixed-signal designs
  • Engagement with foundry partners

Key Requirements

  • Master’s degree in relevant field
  • Minimum 10+ years of semiconductor experience
  • Proven expertise in package technologies

Work Rights

Not specified

Tailored Resume

Cover Letter