Early engagement & execution of a Packaging Technology development working with OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs
Job Summary
Early engagement & execution of a Packaging Technology development working with OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs.
Lead and Manage OSAT New Technology and New Product Introduction, Qualification, HVM, in a timely and flawless manner.
Provide best in class industry “know-how” to enable continued global leadership of QORVO package solutions.
Matching Summary
Early engagement & execution of a Packaging Technology development working with OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs.
Skills & Requirements
Must-have
Packaging Technology development
New Technology and New Product Introduction
Assembly engineering problem-solving
cross functional team collaboration
OSAT on-site management
Nice-to-have
open minded to learn
detail-orientated
proactive
quick learner
fast-paced environment
Key Requirements
minimum of 10 years in semiconductor packaging or assembly engineering
Bachelor’s or master’s degree in mechanical engineering, Material Science engineering or a related field