Principal / Senior Engineer, Process Engineering (advanced Packaging)

Asm

Singapore, Singapore
On-site
Advanced packaging deposition (ald, pecvd, pvd, ecp)
Thin-film deposition and materials characterization
Hybrid bonding (w2w/d2w)
ASM is seeking a Principal/Senior Engineer in Process Engineering, specializing in advanced packaging, to enhance their semiconductor technologies. The role involves developing innovative solutions, mentoring engineers, and collaborating with teams to improve product performance

Job Summary

  • Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions and surface preparation.
  • Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods.
  • Collaborate with customers and marketing teams to define requirements and execute demonstrations.

Matching Summary

Match Score: 85

ASM is seeking a Principal/Senior Engineer in Process Engineering, specializing in advanced packaging, to enhance their semiconductor technologies. The role involves developing innovative solutions, mentoring engineers, and collaborating with teams to improve product performance.

Skills & Requirements

Must-have

  • Advanced Packaging deposition (ALD, PECVD, PVD, ECP)
  • Thin-film deposition and materials characterization
  • Hybrid bonding (W2W/D2W)
  • Design and conduct complex experiments using DOE and RSM

Nice-to-have

  • Mentorship and technical problem-solving
  • Customer and marketing collaboration
  • Draft technical papers and generate IP

Key Requirements

  • Bachelor's, Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics
  • Minimum 10 years of combined experience in thin-film deposition and advanced packaging
  • Direct experience working on D2W/W2W Hybrid bonding
  • Proficiency in materials characterization techniques
  • Knowledge of electrical characterization techniques for CMOS devices

Work Rights

Not specified

Tailored Resume

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