Senior / Engineer, Process Engineering (advanced Packaging)

Asm

Singapore, Singapore
On-site
Thin-film deposition
Surface preparation processes
Ald, pecvd, pvd, ecp
ASM is seeking a Senior/Engineer in Process Engineering focused on advanced packaging to join their innovative team in Singapore. The role involves developing and optimizing semiconductor processes while supporting customer success through hands-on work and collaboration

Job Summary

  • As a Senior / Engineer, Process Engineering in Advanced Packaging, you will start your engineering career at the heart of semiconductor innovation.
  • Support the development and optimization of semiconductor processes for advanced packaging applications, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation.
  • Develop new films or processes for emerging packaging applications like hybrid bonding and perform advanced materials characterization.

Matching Summary

Match Score: 85

ASM is seeking a Senior/Engineer in Process Engineering focused on advanced packaging to join their innovative team in Singapore. The role involves developing and optimizing semiconductor processes while supporting customer success through hands-on work and collaboration.

Skills & Requirements

Must-have

  • thin-film deposition
  • surface preparation processes
  • ALD, PECVD, PVD, ECP
  • experimental data analysis
  • process integration
  • cleanroom environments

Nice-to-have

  • collaborative culture
  • cutting edge technology
  • multicultural environment
  • structured problem-solving

Key Requirements

  • Ph.D. or Master's degree
  • Bachelor's with strong research background
  • Semiconductor processing experience
  • Thin-film deposition or process technique familiarity
  • Hybrid bonding concepts exposure
  • Experimental methods understanding
  • Materials or surface characterization exposure

Work Rights

Not specified

Tailored Resume

Cover Letter