$176,000.00 - $242,000.00; not specified; not spec...
Hybrid
Advanced packaging process flows
Design for manufacturability (dfm)
Design for reliability (dfr)
Applied Materials is a global leader in materials engineering solutions for new chips and advanced displays, enabling exciting technologies like AI and IoT
Job Summary
Applied Materials is a global leader in materials engineering solutions for new chips and advanced displays, enabling exciting technologies like AI and IoT.
Key responsibilities include defining, developing, and optimizing advanced packaging process flows, leading technical projects for DFM/DFR, and analyzing data to root-cause yield limiters.
The company offers a supportive work culture encouraging career growth, comprehensive benefits, and potential eligibility for bonus and stock awards.
Matching Summary
Applied Materials is a global leader in materials engineering solutions for new chips and advanced displays, enabling exciting technologies like AI and IoT.
Salary
$176,000.00 - $242,000.00; Not specified; Not specified
Skills & Requirements
Must-have
Advanced packaging process flows
Design for Manufacturability (DFM)
Design for Reliability (DFR)
Wafer-level and package-level experiments
Yield and failure analysis
Silicon-to-package interaction (SPI)
Nice-to-have
Supportive work culture
Continuous learning and development
Creative problem solving
Cross-functional collaboration
Key Requirements
Experience with TSV, RDL, bump, hybrid bonding, die stacking