Staff Product Engineer (adv Pkg Pathfinding), Heterogeneous Integration Group(hig), High Bandwidth Memory (hbm)

Micron Technology

United States
Not specified; not specified; benefits: medical, d...
Onsite with international travel to singapore and taiwan
10+ years semiconductor industry experience
Advanced package process integration knowledge
Dram or memory product expertise
Micron Technology is seeking a Staff Product Engineer for its High Bandwidth Memory (HBM) team, focused on advanced packaging and product engineering. The role requires extensive experience in the semiconductor industry, specifically related to packaging processes and memory technologies, with responsibilities including team leadership, collaboration across functions, and project management

Job Summary

  • The role involves leading a distributed team of professional Product Engineers managing a portfolio of outstanding Next Generation HBM products while driving quality, cost, cycle time, and scale objectives.
  • You will collaborate with Advanced Package Technology and Test Solutions teams to enable sophisticated interconnect technology solutions including wafer-to-wafer bonding and provide analysis of yield and electrical characteristics data.
  • Micron offers a robust benefits package including medical, dental, vision plans, income protection, paid family leave, and a generous paid time-off program designed to support personal wellbeing and professional growth.

Matching Summary

Match Score: 85

Micron Technology is seeking a Staff Product Engineer for its High Bandwidth Memory (HBM) team, focused on advanced packaging and product engineering. The role requires extensive experience in the semiconductor industry, specifically related to packaging processes and memory technologies, with responsibilities including team leadership, collaboration across functions, and project management.

Salary

Not specified; Not specified; Benefits: Medical, dental, vision, paid family leave, PTO

Skills & Requirements

Must-have

  • 10+ years semiconductor industry experience
  • Advanced package process integration knowledge
  • DRAM or memory product expertise
  • Electrical failure analysis skills
  • JMP data analysis tool proficiency
  • Team leadership and mentoring capability

Nice-to-have

  • Memory testing methodology familiarity
  • Flexible approach to dynamic roles
  • Strong collaborative cross-functional work
  • Project management skill development
  • Risk analysis decision making

Key Requirements

  • Bachelor's/Master's/Ph.D. in Engineering or related field
  • Minimum 10 years of semiconductor industry experience
  • Deep knowledge of sophisticated package process/integration
  • Work on site in US with international travel

Work Rights

Not specified

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