Package Design Engineer

Teledyne Technologies Incorporated

Saint-Egrève, France
Package design flow management
Organic and ceramic multi-layer packaging
Cadence apd layout mastery
The role involves leading the complete design flow of advanced microelectronic packages from customer needs to final validation

Job Summary

  • The role involves leading the complete design flow of advanced microelectronic packages from customer needs to final validation.
  • Candidates will act as the key technical interface with packaging vendors and assembly houses throughout the project lifecycle.
  • Teledyne e2v offers a structured onboarding program with a dedicated mentor and opportunities for international exposure within the Teledyne group.

Matching Summary

The role involves leading the complete design flow of advanced microelectronic packages from customer needs to final validation.

Skills & Requirements

Must-have

  • Package design flow management
  • Organic and ceramic multi-layer packaging
  • Cadence APD layout mastery
  • Vendor and assembly house technical interface
  • Electrical thermal mechanical simulations

Nice-to-have

  • Experience in imaging and assembly
  • SolidWorks basic mechanical design
  • Ansys electrical modelisation knowledge
  • System and sub-system development experience
  • Spanish language skills

Key Requirements

  • Master's degree in microelectronics or related field
  • Confirmed experience in packaging design
  • Fluency in English (B2 minimum) and French
  • Background in material science or micromechanics

Work Rights

Not specified

Tailored Resume

Cover Letter