Watd Module Development Engineer

Inteelabs

Hillsboro, Oregon, US
Base: $155,520.00-219,550.00 usd; bonus/equity: no...
Hybrid
Semiconductor packaging
Process development
Statistical process control
Join the Wafer Assembly Technology Development Group (WATD) to drive innovation in semiconductor packaging technology

Job Summary

  • Join the Wafer Assembly Technology Development Group (WATD) to drive innovation in semiconductor packaging technology.
  • Collaborate with cross-functional teams and external partners to shape the technological roadmap for next-generation devices.
  • Contribute to Intel's leadership in semiconductor innovation by ensuring product performance, yield, and reliability standards.

Matching Summary

Join the Wafer Assembly Technology Development Group (WATD) to drive innovation in semiconductor packaging technology.

Salary

Base: $155,520.00-219,550.00 USD; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Semiconductor packaging
  • Process development
  • Statistical process control
  • Data analytics
  • Equipment metrology
  • Material selection
  • Cross-functional collaboration

Nice-to-have

  • Advanced packaging technologies
  • Hybrid bonded interconnects
  • RDL-based packaging
  • Machine learning
  • Supplier management
  • Yield improvement

Key Requirements

  • Bachelor's or higher degree in STEM field
  • 6+ years of relevant experience
  • Experience in wafer-level assembly or advanced packaging
  • Experience in statistical process control or data analytics

Work Rights

Not specified

Tailored Resume

Cover Letter