Base: attractive salary based on current income; b...
On-site
Semiconductor packaging technology development
Collaboration with domestic and international suppliers
Project quality and timeline management
TSMC supports the next generation of electronics through cutting-edge semiconductor packaging technology, focusing on maximizing performance, reliability, and manufacturing efficiency
Job Summary
TSMC supports the next generation of electronics through cutting-edge semiconductor packaging technology, focusing on maximizing performance, reliability, and manufacturing efficiency.
The position involves collaboration with diverse teams and suppliers to develop innovative technologies and shape the future of semiconductor packaging products.
Employees will engage in advanced substrate prototype construction, manage project quality and delivery, and lead technological advancements in a fulfilling work environment.
Matching Summary
TSMC supports the next generation of electronics through cutting-edge semiconductor packaging technology, focusing on maximizing performance, reliability, and manufacturing efficiency.
Salary
Base: Attractive salary based on current income; Bonus/Equity: Biannual bonuses plus performance-based annual bonus; Benefits: Commuting allowance up to 100,000 JPY/month, overtime pay, position allowance, social insurance, retirement benefits
Skills & Requirements
Must-have
Semiconductor packaging technology development
Collaboration with domestic and international suppliers
Project quality and timeline management
Technical problem-solving experience
Japanese language proficiency N2 or higher
English communication and documentation skills
Nice-to-have
Independent research and development initiative
Experience with DOE and process window evaluation
Leading engineering and operational meetings
Thermo-mechanical and electrical simulation coordination
Continuous improvement activities
Cross-functional team collaboration
Key Requirements
3+ years semiconductor industry experience
Bachelor’s, Master’s, or Ph.D. degree in engineering
Japanese Language Proficiency Test N2 or higher
TOEIC score 650+ or 550+ with professional English use
Ability to independently set and advance R&D challenges