Principal Technologist

ASM International

Boise, Idaho, US
On-site
15+ years semiconductor experience
Thin film/pecvd/lpcvd/ald process development
New product introduction program management
The role involves leading advanced packaging technology engagement to penetrate key customer new products and applications

Job Summary

  • The role involves leading advanced packaging technology engagement to penetrate key customer new products and applications.
  • Candidates must define overall New Product Introduction schedules and drive execution plans to meet critical customer roadmap milestones.
  • ASM values diversity, inclusion, and sustainability while offering development programs to support employee growth and innovation.

Matching Summary

The role involves leading advanced packaging technology engagement to penetrate key customer new products and applications.

Skills & Requirements

Must-have

  • 15+ years semiconductor experience
  • Thin Film/PECVD/LPCVD/ALD process development
  • New Product Introduction program management
  • Customer R&D and HVM team collaboration
  • Materials Science or Electrical Engineering degree

Nice-to-have

  • Tool vendor experience in semiconductor equipment
  • Strong leadership and talent development skills
  • Cross-functional matrixed relationship building
  • Experience with AI and autonomous driving trends

Key Requirements

  • Bachelor's degree with 15+ years experience OR Master's/PhD with 12+ years
  • Proven success in building collaborative partnerships with customers
  • Effective English oral and written communication skills required

Work Rights

Not specified

Tailored Resume

Cover Letter