Process Engineer – Die To Wafer Hybrid Bonding

Applied Materials Inc

Santa Clara, CA, US
Base: $147,000.00 - $202,500.00; bonus/equity: eli...
Hybrid
Die-to-wafer hybrid bonding experience
Thin-die handling and alignment
Doe-driven experimental design
This role focuses on driving die-to-wafer hybrid bonding R&D for silicon photonics and co-packaged optics applications within the Photonics Platforms Business Group

Job Summary

  • This role focuses on driving die-to-wafer hybrid bonding R&D for silicon photonics and co-packaged optics applications within the Photonics Platforms Business Group.
  • The engineer will develop novel bonding flows enabling photonic-electronic co-integration, a critical enabler for AI and HPC systems.
  • Candidates will receive on-the-job training and hands-on experience with state-of-the-art equipment, including the industry's first fully integrated die-to-wafer hybrid bonding system.

Matching Summary

This role focuses on driving die-to-wafer hybrid bonding R&D for silicon photonics and co-packaged optics applications within the Photonics Platforms Business Group.

Salary

Base: $147,000.00 - $202,500.00; Bonus/Equity: Eligible for bonus and stock award program; Benefits: Comprehensive benefits package including health and wellbeing programs

Skills & Requirements

Must-have

  • Die-to-wafer hybrid bonding experience
  • Thin-die handling and alignment
  • DOE-driven experimental design
  • Plasma activation and surface prep
  • Failure analysis and characterization

Nice-to-have

  • Strong problem-solving skills
  • Collaborative multidisciplinary teamwork
  • Self-starter with minimal supervision
  • Experience with optical interconnects
  • Customer engagement capabilities

Key Requirements

  • M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics, or related STEM discipline
  • In-depth knowledge of 2.5D/3D integration
  • Direct process engineer experience on mainstream semiconductor equipment

Work Rights

Not specified

Tailored Resume

Cover Letter