Mts Packaging Integration Engineer

GlobalFoundries

Base: $94,300.00 - $175,100.00; bonus/equity: not ...
Hybrid
Siph flip chip assembly
Electro-optical transceivers
2.5d and 3d co-packaged optics
This hands-on assembly integration role will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements

Job Summary

  • This hands-on assembly integration role will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements.
  • The candidate will bring a strong focus on tool process interactions for each assembly step in a SiPh Flip Chip assembly.
  • Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts.

Matching Summary

This hands-on assembly integration role will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements.

Salary

Base: $94,300.00 - $175,100.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • SiPh Flip Chip assembly
  • electro-optical transceivers
  • 2.5D and 3D co-packaged optics
  • photonic interconnect compatibility
  • electrical interconnect solutions
  • process integration specifications
  • manufacturing driven design rules

Nice-to-have

  • materials science background
  • thermal simulation background
  • mechanical simulation background
  • global technology trends

Key Requirements

  • MS, or PhD + 4 years experience
  • Failure analysis experience
  • Design of experiments experience
  • Packaging process integration experience
  • Bringing packaged products to production

Work Rights

Not specified

Tailored Resume

Cover Letter