Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement
Job Summary
Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement.
Conducts physical and technical failure analysis to identify defects causing inline yield loss and determines root cause using advanced characterization techniques.
Documents and communicates findings through technical reports and presentations to engineers, operators, and management, and provides recommendations for process, material, or equipment improvements.
Matching Summary
Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement.