Technical interface with vendors and assembly houses
The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews
Job Summary
The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.
Teledyne e2v offers a human-scale site environment with opportunities for career development, international exposure, and a structured onboarding program with a dedicated mentor.
The company is committed to innovation, work-life balance, QHSE/CSR goals, gender equality, and fostering a culture built on respect, integrity, responsibility, and citizenship.
Matching Summary
The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.
Skills & Requirements
Must-have
microelectronics packaging design flow
package layout with signal/power integrity
technical interface with vendors and assembly houses
electrical, thermal, mechanical simulations
design reviews and DRC checks
Nice-to-have
knowledge of electrical modelisation tools
experience in imaging and assembly
system and sub-system development experience
multilingual communication skills
customer focused and team-worker
Key Requirements
background in microelectronics or electronics
confirmed experience in packaging design
mastery of package design flow and layout tools
experience managing package vendors and assembly houses