Applied Materials is a global leader in materials engineering solutions for chip and display manufacturing
Job Summary
Applied Materials is a global leader in materials engineering solutions for chip and display manufacturing.
The Advanced Packaging Development Center (APDC) is a state-of-the-art lab focused on wafer-level packaging and heterogeneous integration.
This role offers on-job training on CoW hybrid bonding processes, hands-on experience with advanced equipment and metrologies, and exposure to upstream/downstream integration.
Matching Summary
Applied Materials is a global leader in materials engineering solutions for chip and display manufacturing.
Skills & Requirements
Must-have
hybrid bonding process development
pretreatment process development
die stacking challenges
CnF tests
prototype next gen pretreatment modules
evaluate proto chamber
Nice-to-have
supportive work culture
continuous learning and growth
pushing boundaries of innovation
health and wellbeing programs
Key Requirements
Engineering or science university educational background
Prior hands-on experience with plasma or wet cleans tools