半導体製造装置部門アプリケーションエンジニア(pcs)

Zeiss Group

Nagoya, Japan
Base: 5,500,000 - 9,000,000 jpy; bonus/equity: not...
Experience with sem imaging
Technical support for fib-sem
Willingness to travel over 50%
The role involves optimizing and validating 3D tomography FIB/SEM solutions for semiconductor labs and manufacturing facilities

Job Summary

  • The role involves optimizing and validating 3D tomography FIB/SEM solutions for semiconductor labs and manufacturing facilities.
  • You will act as the main point of contact for customers, coordinating technical discussions and reviews.
  • The position requires over 50% travel to customer sites in the USA, Korea, and Japan.

Matching Summary

The role involves optimizing and validating 3D tomography FIB/SEM solutions for semiconductor labs and manufacturing facilities.

Salary

Base: 5,500,000 - 9,000,000 JPY; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Experience with SEM imaging
  • Technical support for FIB-SEM
  • Willingness to travel over 50%

Nice-to-have

  • Knowledge of semiconductor device analysis
  • Experience in 3D tomography
  • Strong communication skills

Key Requirements

  • Practical experience in sample preparation using FIB-SEM
  • Ability to communicate in English
  • Driver's license required

Work Rights

Not specified

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