Senor Wire Bonding Manufacturing / Process Development Engineer
flir.fr
Unknown
Base: $113,600.00-$151,400.00; bonus/equity: not s...
Automated wire bonding process expertise
Process development and optimization
Statistical analysis and doe
The engineer is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing
Job Summary
The engineer is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements.
The engineer acts as a technical subject matter expert, providing hands-on support to operators and technicians while collaborating cross-functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.
Matching Summary
The engineer is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
Salary
Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Automated wire bonding process expertise
Process development and optimization
Statistical analysis and DOE
Equipment troubleshooting and maintenance
Process control and quality compliance
Cross-functional collaboration
Nice-to-have
Experience with MES systems
Lean manufacturing and 5S knowledge
Strong communication and training skills
Digital process documentation tools
Experience in aerospace or defense environments
Key Requirements
Bachelor’s degree in relevant engineering field preferred
3+ years experience in microelectronics manufacturing