Assembly Process Technician (die Attach)

onsemi

Tarlac City, Philippines
Die attach equipment operation
Process parameter setting
Microscope inspection
A Diebond (or Die Attach) Assembly Process Technician in the semiconductor industry is responsible for the precise, automated attachment of silicon dies to a substrate or leadframe

Job Summary

  • A Diebond (or Die Attach) Assembly Process Technician in the semiconductor industry is responsible for the precise, automated attachment of silicon dies to a substrate or leadframe.
  • They operate, troubleshoot, and maintain high-precision die-bonding equipment, ensuring that epoxy application, die placement, and bond line thickness meet quality standards.
  • onsemi is driving disruptive innovations to help build a better future, focusing on automotive and industrial end-markets.

Matching Summary

A Diebond (or Die Attach) Assembly Process Technician in the semiconductor industry is responsible for the precise, automated attachment of silicon dies to a substrate or leadframe.

Skills & Requirements

Must-have

  • Die attach equipment operation
  • Process parameter setting
  • Microscope inspection
  • Shear testing
  • Epoxy application monitoring

Nice-to-have

  • High-performance innovators
  • Positive recruitment experience
  • Intelligent power and sensing technologies

Key Requirements

  • Associate degree in technical field preferred
  • Semiconductor manufacturing experience preferred
  • Cleanroom environment experience
  • Basic computer skills

Work Rights

Not specified

Tailored Resume

Cover Letter