Product Packaging Engineer

Intel Jobs

Phoenix, Arizona, US
Base: $141,910.00-200,340.00 usd; bonus/equity: st...
Product packaging assembly processes
Statistical process control (spc)
Design of experiments (doe)
As a Product Packaging Engineer, you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products

Job Summary

  • As a Product Packaging Engineer, you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products.
  • This role will empower you to influence manufacturing processes, enhance efficiency, and support Intel's growth in the competitive semiconductor industry.
  • Intel offers a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs covering health, retirement, and vacation.

Matching Summary

As a Product Packaging Engineer, you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products.

Salary

Base: $141,910.00-200,340.00 USD; Bonus/Equity: Stock bonuses; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • Product packaging assembly processes
  • Statistical process control (SPC)
  • Design of experiments (DOE)
  • Design for manufacturing (DFM)
  • Packaging qualification testing
  • Risk analysis and regulatory compliance

Nice-to-have

  • Surface Mount Technologies experience
  • Solder joint quality and reliability
  • Leading technical teams
  • Semiconductor device fabrication knowledge
  • Innovation and strategic planning
  • Effective cross-organizational communication

Key Requirements

  • Master's degree in Engineering, Physics, Chemistry, or related STEM field with 1+ years experience
  • Or PhD in related STEM field with 6+ months experience
  • Experience in product packaging assembly and production methodologies
  • Proficiency in SPC and DOE techniques
  • Analytical skills in data analysis and risk assessment
  • Experience with design for manufacturing and packaging test criteria

Work Rights

Not specified

Sponsorship: available

Tailored Resume

Cover Letter