This role involves leading the development of Intel's advanced chip packaging process technology within the MIHL module engineering team
Job Summary
This role involves leading the development of Intel's advanced chip packaging process technology within the MIHL module engineering team.
The engineer will establish metrology and defect inspection capabilities to accelerate process development and ensure effective outgoing quality screening.
Responsibilities include developing inspection process recipes, engaging in Auto Inspection and Disposition, and optimizing next-generation Machine Learning models.
Matching Summary
This role involves leading the development of Intel's advanced chip packaging process technology within the MIHL module engineering team.
Skills & Requirements
Must-have
Bachelor's or Master's degree in Engineering
Optics fundamentals applied to imaging techniques
Statistical process control (SPC) and DOE
Troubleshoot ultra-high precision equipment
Light-matter interaction understanding
Nice-to-have
Python data science and statistics tools
Machine Vision techniques and OpenCV experience
CNN Image Classification experience
Dimensional management for package features
Data management and visualization experience
Key Requirements
Minimum Bachelor's or Master's degree in STEM field