Base: $125,000 - $210,000 py; bonus/equity: not sp...
On-site
Advanced semiconductor packaging technology
3dfabric technology portfolio
2.5d/3d packaging
Our mission is to empower customers to rapidly and efficiently design their next generation of 'must-have' products by deeply understanding their technical needs, then defining, promoting, and enabling the most competitive and innovative packaging solutions within our cutting-edge 3DFabric technology portfolio
Job Summary
Our mission is to empower customers to rapidly and efficiently design their next generation of 'must-have' products by deeply understanding their technical needs, then defining, promoting, and enabling the most competitive and innovative packaging solutions within our cutting-edge 3DFabric technology portfolio.
Build relationships and trust with customers through technical interaction, own the technical solution for customers, and champion their needs.
Manage customer projects for advanced 2.5D/3D packaging, including those for leading AI/HPC applications, guiding them from conceptualization through production qualification.
Matching Summary
Our mission is to empower customers to rapidly and efficiently design their next generation of 'must-have' products by deeply understanding their technical needs, then defining, promoting, and enabling the most competitive and innovative packaging solutions within our cutting-edge 3DFabric technology portfolio.
Salary
Base: $125,000 - $210,000 per year; Bonus/Equity: Not specified; Benefits: Not specified