Lead the development and deployment of Intel's advanced chip packaging process technology focusing on packaging inspection technologies
Job Summary
Lead the development and deployment of Intel's advanced chip packaging process technology focusing on packaging inspection technologies.
Work with cross-functional teams to establish metrology and defect inspection capabilities that accelerate process development and ensure outgoing quality screening.
Drive improvements in quality, reliability, cost, yield, process stability, productivity, and safety/ergonomics through testing and validation of hardware/software upgrades.
Matching Summary
Lead the development and deployment of Intel's advanced chip packaging process technology focusing on packaging inspection technologies.
Skills & Requirements
Must-have
Inspection process recipes development
Material interactions understanding
Product Inspection module FMEA
New inspection capability assessment
AID and Machine Learning model development
Hardware/software upgrade testing
Nice-to-have
Data science and statistics tools
Machine Vision techniques
Dimensional management for package features
Key Requirements
Bachelor's or Master's degree in Engineering or Physics or Computer Science
Fundamental physical processes troubleshooting
Optics fundamentals for imaging techniques
Statistical principles, SPC, and DOE understanding
Apply scientific and engineering principles for novel design solutions