Advanced Packaging Flagship Curriculum Internship Program
Intel Retiree Medical Plan Trust
Kulim, Malaysia
On-site
Advanced packaging flagship curriculum completion
Materials characterization skills
Design of experiments (doe) application
Intel is offering an internship focused on advanced packaging in the semiconductor industry, providing hands-on experience to undergraduate students who have completed the EBB302 curriculum at Universiti Sains Malaysia. Interns will work closely with engineering teams to drive process improvements and support research and development efforts
Job Summary
This internship offers hands-on experience in the semiconductor industry while collaborating with engineering teams to troubleshoot equipment and drive process improvements.
Candidates will apply principles of Design of Experiments (DOE) and utilize computational tools like finite element analysis to validate hypotheses and refine process designs.
The role is specifically designed for undergraduate students who have completed the EBB302 Advanced Packaging Flagship Curriculum at Universiti Sains Malaysia.
Matching Summary
Match Score: 85
Intel is offering an internship focused on advanced packaging in the semiconductor industry, providing hands-on experience to undergraduate students who have completed the EBB302 curriculum at Universiti Sains Malaysia. Interns will work closely with engineering teams to drive process improvements and support research and development efforts.
Skills & Requirements
Must-have
Advanced Packaging Flagship Curriculum completion
Materials characterization skills
Design of Experiments (DOE) application
Lab-scale experiment execution
Finite element analysis usage
Computational fluid dynamics usage
Nice-to-have
Collaboration with engineering teams
Technical documentation clarity
Process mechanics understanding
Innovation drive capability
Key Requirements
Completion of EBB302 Advanced Packaging Flagship Curriculum