C4 Module Equipment Technician (nightshift)

Intel

Hillsboro, Oregon, US
Base: $51,710.00-99,770.00 usd; bonus/equity: stoc...
Onsite
Electrical and mechanical troubleshooting
Equipment setup and calibration
Preventative maintenance
Join Intel's Wafer Packaging Manufacturing (WPM) organization to drive advanced packaging strategy and shape the future of semiconductor technology

Job Summary

  • Join Intel's Wafer Packaging Manufacturing (WPM) organization to drive advanced packaging strategy and shape the future of semiconductor technology.
  • Responsibilities include performing electrical/mechanical troubleshooting, equipment setup, calibration, preventative maintenance, and data analysis to improve tool performance.
  • Intel offers a competitive total compensation package including pay, stock bonuses, health, retirement, and vacation benefits.

Matching Summary

Join Intel's Wafer Packaging Manufacturing (WPM) organization to drive advanced packaging strategy and shape the future of semiconductor technology.

Salary

Base: $51,710.00-99,770.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Electrical and mechanical troubleshooting
  • Equipment setup and calibration
  • Preventative maintenance
  • Data analysis for tool performance
  • Cleanroom environment work
  • Compressed night shift schedule

Nice-to-have

  • Collaborative and supportive environment
  • Continuous learning mindset
  • High attention to detail
  • Works well in dynamic environments

Key Requirements

  • Bachelor's Degree in STEM or equivalent experience
  • Associate degree and 2+ years equipment maintenance experience
  • Highschool diploma and 3+ year Technical/trade certification
  • Highschool diploma and 4+ years military technical training
  • Highschool diploma and 2.5+ years semiconductor equipment experience

Work Rights

Not specified

Tailored Resume

Cover Letter