Senior Packaging Technical Engineer - Hardware

Invidia

Remote
Base: 168,000 usd - 258,750 usd for level 4, 200,0...
Chip pad ring design
Substrate interconnect scheme
Package layout design process
As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work

Job Summary

  • As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work.
  • In this position, you’ll be responsible for crafting and implementing silicon pad rings, as well as working with a variety of package technology types and complex technologies.
  • Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package.

Matching Summary

As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work.

Salary

Base: 168,000 USD - 258,750 USD for Level 4, 200,000 USD - 322,000 USD for Level 5; Bonus/Equity: Eligible for equity; Benefits: Comprehensive benefits package

Skills & Requirements

Must-have

  • Chip pad ring design
  • Substrate interconnect scheme
  • Package layout design process
  • Transmission line theory knowledge
  • Power delivery and signal integrity
  • Collaboration with engineering teams

Nice-to-have

  • Programming and scripting skills
  • Perl, Python, Tcl experience
  • Cadence Skill familiarity
  • Excel proficiency
  • Innovative problem solving
  • Proactive ownership

Key Requirements

  • BSEE or equivalent experience
  • Minimum of 8+ years in board/system design
  • Experience with package design preferred
  • Must be hardworking with minimal supervision

Work Rights

Not specified

Tailored Resume

Cover Letter