Module Process Engineer Iv - (e4) – Plasma Etch

Applied Materials Inc

Boise, ID, US
Base: $116,000.00 - $159,500.00; bonus/equity: eli...
Not specified
7+ years plasma etch process engineering experience
Deep wafer fab background required
Strong data analytics capability for yield analysis
Applied Materials is seeking a Module Process Engineer IV specializing in plasma etch technologies to join their team in Boise, ID. The role involves leading technical discussions, implementing continuous improvement projects, and mentoring junior engineers in a supportive and innovative work culture

Job Summary

  • The role involves leading technical discussions with customers to define and implement Continuous Improvement Projects that deliver measurable improvements to customer KPIs.
  • Candidates must demonstrate deep expertise in plasma etch technologies and possess strong data analytics capabilities to resolve complex equipment and process issues.
  • The position offers a supportive work culture focused on personal and professional growth, along with comprehensive benefits including bonus and stock award programs.

Matching Summary

Match Score: 85

Applied Materials is seeking a Module Process Engineer IV specializing in plasma etch technologies to join their team in Boise, ID. The role involves leading technical discussions, implementing continuous improvement projects, and mentoring junior engineers in a supportive and innovative work culture.

Salary

Base: $116,000.00 - $159,500.00; Bonus/Equity: Eligible for bonus and stock award program; Benefits: Comprehensive benefits package including health and wellbeing programs

Skills & Requirements

Must-have

  • 7+ years plasma etch process engineering experience
  • Deep Wafer Fab background required
  • Strong data analytics capability for yield analysis
  • Expertise in hardware and plasma etch processes
  • Ability to travel domestically up to 50%

Nice-to-have

  • Experience with two or more plasma etch technologies
  • Domain knowledge of four or more processes
  • Advanced integration knowledge of adjacent disciplines
  • Experience with Joint Development Programs (JDPs)
  • Proven ability to influence senior stakeholders

Key Requirements

  • BS in Engineering, Physics, or Chemistry
  • 7+ years of experience in plasma etch process engineering
  • Strong Wafer Fab and semiconductor equipment experience

Work Rights

Not specified

Tailored Resume

Cover Letter