Bachelor's degree in materials science or engineering
3-7 years semiconductor fab experience
Electro plating and pvd process expertise
This role provides high-visibility technical support at customer sites to enable next-generation semiconductor packaging technologies
Job Summary
This role provides high-visibility technical support at customer sites to enable next-generation semiconductor packaging technologies.
Engineers will diagnose and resolve complex process issues through structured root cause analysis while optimizing Electro Plating and PVD processes.
The position offers the opportunity to work directly with leading semiconductor manufacturers on advanced packaging technologies within a supportive global company.
Matching Summary
This role provides high-visibility technical support at customer sites to enable next-generation semiconductor packaging technologies.
Skills & Requirements
Must-have
Bachelor's degree in Materials Science or Engineering
3-7 years semiconductor fab experience
Electro Plating and PVD process expertise
Root cause analysis and DOE execution
Customer-facing technical support skills
Nice-to-have
Master's degree or PhD in related field
NOKOTA Charger system experience
Strong statistical data analysis proficiency
Mentoring junior engineers capability
Collaborative problem-solving mindset
Key Requirements
Bachelor's degree in Materials Science, Chemistry, or Engineering
3–7 years of experience in semiconductor fab or equipment environment
Proficiency in English for technical communication