Responsibilities: Design and develop high-precision mechanical modules and components for advanced semiconductor packaging applications. Translate customer requirements into mechanical design specifications and optimized engineering solutions. Perform design validation through force analysis, thermal simulation, vibration studies, and structural assessments. Select suitable materials and develop precision tooling and fixtures to support manufacturing and reliability requirement Collaborate closely with manufacturing and process engineering teams to ensure design for manufacturability and seamless integration. Drive continuous improvement initiatives to enhance equipment performance, reliability, and design efficiency. Ensure compliance with safety, quality, and environmental standards while utilizing CAD tools such as SolidWorks, Solid Edge, Pro-E, and AutoCAD. Requirements: Degree in Mechanical Engineering At least 5 years of experience Semiconductor industry Account Manager: Kerwin Tan Kai Bin (R1331624) kerwin.tan@searchasia.com.sg EA16S8107
SGD 5,000 - 7,000 / Monthly
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