Advanced Packaging Td Plating Module Engineer

Intel Corporation

Hillsboro, Oregon, US
Base: $155,520.00-219,550.00 usd; bonus/equity: st...
Electroplating process development
Advanced packaging technology
Equipment and material supplier collaboration
Lead the plating process development, optimize equipment solutions, material & chemical selection, and perform feasibility studies to meet device specifications

Job Summary

  • Lead the plating process development, optimize equipment solutions, material & chemical selection, and perform feasibility studies to meet device specifications.
  • Drive technology development and enablement for current and future nodes for electroplating needs, including material selection, parameter optimization, and equipment metrology.
  • We offer a total compensation package that ranks among the best in the industry, consisting of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Matching Summary

Lead the plating process development, optimize equipment solutions, material & chemical selection, and perform feasibility studies to meet device specifications.

Salary

Base: $155,520.00-219,550.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Electroplating process development
  • Advanced packaging technology
  • Equipment and material supplier collaboration
  • Process optimization and improvement
  • Technology roadmap development

Nice-to-have

  • Innovative and disciplined individuals
  • Passion for advancing semiconductor technology
  • Recognized technical leadership
  • Strong collaboration skills

Key Requirements

  • Master’s degree with 6+ years of experience or PhD with 4+ years of experience
  • 3+ years of experience in Electrochemical Plating
  • Experience in fab process development
  • Experience in advanced packaging technology

Work Rights

Not specified

Tailored Resume

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