This role leads the end-to-end integration of advanced semiconductor packaging platforms including 2.5D, 3D, and heterogeneous system integration
Job Summary
This role leads the end-to-end integration of advanced semiconductor packaging platforms including 2.5D, 3D, and heterogeneous system integration.
The successful candidate will own the post-fabrication value chain from wafer-level processes through assembly, qualification, and reliability for high-performance applications.
Key responsibilities include defining manufacturing test specifications, driving cross-functional alignment, and conducting physical failure analysis to improve yield.
Matching Summary
Match Score: 85
This role leads the end-to-end integration of advanced semiconductor packaging platforms including 2.5D, 3D, and heterogeneous system integration.
Skills & Requirements
Must-have
8-20 years semiconductor packaging experience
2.5D/3D/3.5D advanced packaging development
CoW CoP bonding and integration schemes
MEOL BEOL RDL process knowledge
JEDEC reliability qualification standards
Physical Failure Analysis (pFA) expertise
Nice-to-have
Fluent Korean language proficiency
Experience with AI HPC automotive platforms
Statistical analysis and DOE optimization skills
Cross-functional team leadership abilities
Key Requirements
Bachelor's degree in Electrical Engineering or related discipline
8-20 years of experience in semiconductor packaging