Director Of Mission Products & Payload Integration
Inversionspace
Playa Vista, United States
On-site
Deep aerospace engineering judgment
Payload integration expertise
Mission design and trajectory analysis
Inversionspace is seeking a Director of Mission Products & Payload Integration to lead the development of technical products that enhance payload integration and mission design for their aerospace re-entry vehicles. This strategic leadership role requires a blend of aerospace engineering expertise and product management skills, with a focus on customer needs in hypersonic testing and advanced payload development
Job Summary
The role involves leading a new organization to define technical products that enable seamless payload integration for Arc's re-entry vehicles.
Candidates must possess deep aerospace engineering judgment combined with strong product instincts to serve hypersonic test and defense customers.
Responsibilities include owning the payload bay design strategy, defining standard envelopes, and driving mission design capabilities from concept through flight.
Matching Summary
Match Score: 85
Inversionspace is seeking a Director of Mission Products & Payload Integration to lead the development of technical products that enhance payload integration and mission design for their aerospace re-entry vehicles. This strategic leadership role requires a blend of aerospace engineering expertise and product management skills, with a focus on customer needs in hypersonic testing and advanced payload development.
Skills & Requirements
Must-have
Deep aerospace engineering judgment
Payload integration expertise
Mission design and trajectory analysis
Customer empathy for defense/hypersonic markets
Strategic roadmap leadership
Nice-to-have
Strong product instincts
Ability to lead high-performing teams
Experience with avionics interfaces
Background in advanced payload development
Key Requirements
Director or Senior Director level experience
Leadership of engineering and product teams
Expertise in mechanical, electrical, thermal, and digital interfaces