Principal Si/pi Design Engineer

Ciena Corporation

Base: $157,100 - $250,900 usd annually; bonus: dis...
Not specified
Bs in electrical engineering or physics
5+ years hands on experience with ic package design
Proficient in advanced package designer or xpedition package designer tools
Ciena Corporation is seeking a Principal SI/PI Design Engineer to lead the electrical package design for custom in-house photonic and ICs. The ideal candidate should have a strong background in IC package design and experience with simulation tools, contributing to next-generation optical modules while thriving in a people-first, flexible work environment

Job Summary

  • As the global leader in high-speed connectivity, Ciena is committed to a people-first approach with a culture focused on flexible work environments.
  • The role involves owning advanced package selection, new product BGA configuration, and driving the full lifecycle from layout to tapeout for next-generation optical modules.
  • Ciena offers a comprehensive benefits package including medical, dental, vision, 401(K) matching, and Employee Stock Purchase Program alongside competitive compensation.

Matching Summary

Match Score: 85

Ciena Corporation is seeking a Principal SI/PI Design Engineer to lead the electrical package design for custom in-house photonic and ICs. The ideal candidate should have a strong background in IC package design and experience with simulation tools, contributing to next-generation optical modules while thriving in a people-first, flexible work environment.

Salary

Base: $157,100 - $250,900 USD annually; Bonus: Discretionary incentive bonus eligible for non-sales employees; Benefits: Medical, dental, vision, 401(K) match, ESPP, paid leave

Skills & Requirements

Must-have

  • BS in Electrical Engineering or Physics
  • 5+ years hands on experience with IC package design
  • Proficient in Advanced Package Designer or Xpedition Package Designer tools
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS

Nice-to-have

  • Substrate design experience for RF, digital, high speed and mixed signal die
  • Experience in package design for manufacturing reviews
  • Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers

Key Requirements

  • Bachelor's degree in Electrical Engineering or Physics
  • Minimum 5 years of hands-on IC package design experience
  • Proficiency with Cadence APD+ SIP and XPD tools
  • Strong background in Signal and Power Integrity fundamentals

Work Rights

Not specified

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