Senior Wire Bonding Manufacturing / Process Development Engineer

Teledyne FLIR

Base: $113,600.00-$151,400.00; bonus/equity: not s...
Automated wire bonding process development
Design of experiments (doe) and statistical analysis
Troubleshooting equipment and process issues
The role involves developing and optimizing automated wire bonding processes to ensure high reliability and compliance with industry standards

Job Summary

  • The role involves developing and optimizing automated wire bonding processes to ensure high reliability and compliance with industry standards.
  • Candidates must provide hands-on engineering support to resolve production issues and drive continuous improvement initiatives.
  • This position requires a technical subject matter expert capable of leading Design of Experiments to enhance yield and process robustness.

Matching Summary

The role involves developing and optimizing automated wire bonding processes to ensure high reliability and compliance with industry standards.

Salary

Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Automated wire bonding process development
  • Design of Experiments (DOE) and statistical analysis
  • Troubleshooting equipment and process issues
  • Root cause corrective action (RCCA) implementation
  • Compliance with MIL-STD-883 and IPC-A-610

Nice-to-have

  • Experience in aerospace or defense environments
  • Knowledge of epoxy attach and hermetic packaging
  • Familiarity with MES systems and digital tools
  • Strong cross-functional collaboration skills
  • Lean manufacturing and continuous improvement mindset

Key Requirements

  • Bachelor's degree in Engineering or related field
  • 3+ years experience in microelectronics manufacturing
  • US Citizen or PERM Resident status required

Work Rights

Must have US citizenship or be a PERM Resident

Tailored Resume

Cover Letter