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Analog Devices, Inc. is seeking a Failure Analysis Engineer to support new product development and yield improvements for integrated circuits. The role involves collaboration with internal teams and requires expertise in failure analysis methodologies and semiconductor characterization techniques.
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Job Summary
The role supports the reliability of Analog Devices' IC portfolio for qualification and release while resolving fabrication yield and process transfer issues.
Engineers will utilize advanced physical analysis techniques including FIB, SEM, TEM, and X-ray alongside electrical bench testing to characterize new technologies.
Candidates must possess strong problem-solving skills with hands-on semiconductor analysis experience and the ability to compile reports for large interdisciplinary audiences.
Matching Summary
Match Score: 75
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Analog Devices, Inc. is seeking a Failure Analysis Engineer to support new product development and yield improvements for integrated circuits. The role involves collaboration with internal teams and requires expertise in failure analysis methodologies and semiconductor characterization techniques.
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Skills & Requirements
Must-have
Integrated Circuit failure analysis
FIB SEM TEM X-ray inspection
ATE yield result interpretation
Die level schematic layout analysis
Thermal LEM OBIRCH fault localization
Nice-to-have
Lean manufacturing problem solving
Interdisciplinary communication skills
Vendor management experience
Conference presentation capability
Key Requirements
BSC or BEng in Electronic Engineering or Physics
3 to 5 years relevant industry experience
Knowledge of FAB processes and More than Moore Technology
Work Rights
Must be US Citizen, US Permanent Resident, or protected individual; others require export licensing review