Packaging Engineer

Marvell

Not specified; not specified; competitive compensa...
10+ years semiconductor packaging experience
Advanced packaging technologies tsv 2.5d 3d
Hands-on osat integration and process engineering
This role drives Marvell's Photonic AI products from concept to high volume manufacturing through advanced process technology development

Job Summary

  • This role drives Marvell's Photonic AI products from concept to high volume manufacturing through advanced process technology development.
  • Candidates must possess expert-level understanding of packaging assembly and substrate technologies across various package forms.
  • The position requires fluency in both Korean and English along with a Master's or Ph.D. in relevant engineering fields.

Matching Summary

This role drives Marvell's Photonic AI products from concept to high volume manufacturing through advanced process technology development.

Salary

Not specified; Not specified; Competitive compensation and benefits described

Skills & Requirements

Must-have

  • 10+ years semiconductor packaging experience
  • Advanced packaging technologies TSV 2.5D 3D
  • Hands-on OSAT integration and process engineering
  • Wafer process development and Interposer assembly
  • Thermo-mechanical reliability and physics of failures

Nice-to-have

  • Photonics packaging experience preferred
  • Strong project management and executive communication
  • Can-do attitude with high sense of urgency
  • Innovation in advanced package solutions
  • Fluent in Korean and English languages

Key Requirements

  • M.S or Ph.D. in Chemical Engineering Materials Science Mechanical Engineering Chemistry Physics
  • 10+ years experience in Semiconductor Packaging Process Technology Development
  • Fluent in Korean and English language
  • Eligible to access export-controlled information under US law

Work Rights

Must be eligible to access export-controlled information as defined under applicable law

Tailored Resume

Cover Letter