Principal/senior Engineer, Aptd Cem - Advanced Packaging Die Level Technology Engineering
Micron Technology
Semiconductor process development experience
Wafer bonding and die stacking expertise
Python r sql statistical analysis proficiency
The role focuses on developing and optimizing assembly processes for advanced packaging technologies to meet performance, cost, and reliability requirements
Job Summary
The role focuses on developing and optimizing assembly processes for advanced packaging technologies to meet performance, cost, and reliability requirements.
Candidates will work closely with internal and external stakeholders to integrate manufacturing processes for optimal quality control and smooth product transfer.
Micron is seeking experts to drive innovation in high bandwidth memory (HBM) and artificial intelligence enabled solutions.
Matching Summary
The role focuses on developing and optimizing assembly processes for advanced packaging technologies to meet performance, cost, and reliability requirements.
Skills & Requirements
Must-have
Semiconductor process development experience
Wafer bonding and die stacking expertise
Python R SQL statistical analysis proficiency
Nice-to-have
Strong problem-solving under tight timelines
Experience with E3 FDC RMS systems
Collaboration across global engineering teams
Key Requirements
B.S./M.S./Ph.D. in Materials Science or related field
2+ years semiconductor process development experience