Play a critical part in enabling next-generation advanced packaging technologies, including EMIB‑T, glass core, EMIB scaling, and panel‑level packaging
Job Summary
Play a critical part in enabling next-generation advanced packaging technologies, including EMIB‑T, glass core, EMIB scaling, and panel‑level packaging.
Use defect inspection tools to detect and resolve process issues, collaborating with defect reduction, process integration, and module teams to improve yield.
Collaborate with equipment suppliers and GSEM partners to maintain current toolsets and enhance features, such as software and hardware upgrades.
Matching Summary
Play a critical part in enabling next-generation advanced packaging technologies, including EMIB‑T, glass core, EMIB scaling, and panel‑level packaging.
Salary
Base: $120,860.00-170,630.00; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation
Skills & Requirements
Must-have
defect inspection tools
real-time data analysis
micro-contamination detection
tool installation and qualification
WIP velocity targets
Nice-to-have
proactive problem-solving
data-driven decision-making
cross-functional collaboration
adaptability and resilience
Key Requirements
Bachelor's degree in EE, Chem Eng, Optical Eng, Materials Sci, Physics or related field with 3 years semiconductor experience
Master's degree with 2 years semiconductor experience
PhD degree with 1+ years semiconductor experience
3+ years experience in micro-contamination management OR Bright/Dark field inspection technologies
3+ years experience as a yield analyst or defect reduction owner or defect metrology tool ownership