This role leads the thermal system and application architecture for Direct‑to‑Chip (D2C) liquid cooling solutions used in AI and ML data centers
Job Summary
This role leads the thermal system and application architecture for Direct‑to‑Chip (D2C) liquid cooling solutions used in AI and ML data centers.
The individual will be a key technical interface for both prospective and existing customers, providing system‑level expertise in liquid‑cooled AI/ML applications.
The role requires a strong understanding of the thermal characteristics of modern AI/ML chips, including GPUs, AI accelerators, and high-end server CPUs.
Matching Summary
This role leads the thermal system and application architecture for Direct‑to‑Chip (D2C) liquid cooling solutions used in AI and ML data centers.
Skills & Requirements
Must-have
Direct-to-Chip liquid cooling
AI/ML data centers
thermal path assessment
liquid cooling components
heat transfer and fluid flow
Nice-to-have
customer technical interface
system-level trade-offs
technical credibility
early-stage project evaluations
Key Requirements
Bachelor's Degree in Mechanical Engineering, Physics, Material Sciences or related technical field
Demonstrated experience in AI/ML data centers or HPC environments
Strong background in liquid cooling, ideally Direct-to-Chip
Excellent system-level and architectural thinking
Ability to make and justify technical design and component selection decisions