2026 Fall Process Integration Engineer Co-op (cambridge, Ma)
Applied Materials
Cambridge, MA, US
Base: $41 - $50 ph; bonus/equity: eligible for bon...
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Master's or phd degree program
Good academic standing gpa 3.0+
Hands-on semiconductor processing experience
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Applied Materials is seeking a Fall 2026 Process Integration Engineer Co-op in Cambridge, MA, for a hands-on internship focused on semiconductor processing and advanced packaging. The role is ideal for graduate students pursuing degrees in materials science, engineering, or related fields, with a supportive work culture that encourages personal and professional growth.
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Job Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
The position offers hands-on experience in semiconductor and advanced packaging process environments while establishing an understanding of device design and material physics.
Candidates will benefit from a supportive work culture that encourages learning, development, and career growth within a leading global company.
Matching Summary
Match Score: 75
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Applied Materials is seeking a Fall 2026 Process Integration Engineer Co-op in Cambridge, MA, for a hands-on internship focused on semiconductor processing and advanced packaging. The role is ideal for graduate students pursuing degrees in materials science, engineering, or related fields, with a supportive work culture that encourages personal and professional growth.
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Salary
Base: $41 - $50 per hour; Bonus/Equity: Eligible for bonus and stock award program; Benefits: Comprehensive benefits package including health and wellbeing programs
Skills & Requirements
Must-have
Master's or PhD degree program
Good academic standing GPA 3.0+
Hands-on semiconductor processing experience
Nice-to-have
Passionate drive and curious mind
Adaptable spirit and quick learner
Experience in advanced packaging environments
Key Requirements
Pursuing Master's or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or Chemistry
Minimum GPA of 3.0 on a 4.0 scale
Preferred experience in semiconductor processing or manufacturing