Customer Enabling Engineer

Intel Corporation

Phoenix, Arizona, US
Base: $248,400.00-350,690.00 usd; bonus/equity: st...
Hybrid
Assembly packaging technologies
Manufacturing processes and equipment
Customer technical collaboration
Lead and drive innovation in Intel's cutting-edge assembly packaging technologies, optimizing manufacturing processes and solving complex challenges

Job Summary

  • Lead and drive innovation in Intel's cutting-edge assembly packaging technologies, optimizing manufacturing processes and solving complex challenges.
  • Develop and execute strategies to promote Intel Foundry's Advanced Packaging solutions to customers, acting as the center point of contact for all technical collaboration.
  • The role offers a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefits.

Matching Summary

Lead and drive innovation in Intel's cutting-edge assembly packaging technologies, optimizing manufacturing processes and solving complex challenges.

Salary

Base: $248,400.00-350,690.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Assembly packaging technologies
  • Manufacturing processes and equipment
  • Customer technical collaboration
  • Package architecture specification
  • Reliability requirements and modeling
  • Process characterization and quality assurance

Nice-to-have

  • Strong mentoring and coaching skills
  • Exceptional communication and influence
  • Industry recognition for innovation
  • Learning agility and adaptability
  • Strategic problem-solving abilities

Key Requirements

  • 12+ years of experience with Bachelor's degree
  • 8+ years of experience with Master's degree
  • 6+ years of experience with PhD
  • Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or equivalent experience
  • Demonstrated expertise in package design and development
  • Demonstrated experience in Testing including Wafer and package Testing
  • Proficiency in statistical methods, experimental design, and reliability modeling

Work Rights

Not specified

Tailored Resume

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