2025 Intern - Packaging Engineer

NXP Semiconductors

Tianjin, China
New packaging technology development
Advanced material interface study
Advanced ic package failure analysis
This position is a packaging back-end R&D intern, focusing on IC packaging technology research and development

Job Summary

  • This position is a packaging back-end R&D intern, focusing on IC packaging technology research and development.
  • The intern will work with a global team to finish development projects, including new packaging technology and process development.
  • Responsibilities include advanced material interface study, IC package failure analysis, and coordinating development projects independently.

Matching Summary

This position is a packaging back-end R&D intern, focusing on IC packaging technology research and development.

Skills & Requirements

Must-have

  • New packaging technology development
  • Advanced material interface study
  • Advanced IC package failure analysis
  • Cross-functional global team environment

Nice-to-have

  • Independent R&D capability
  • Communication and cooperation among global teams

Key Requirements

  • Master degree in Metallic Materials Engineering, Polymer Materials Engineering, or Mechanical Engineering and Automation
  • CET-4 degree or equivalent English level
  • CET-6 is preferred

Work Rights

Not specified

Tailored Resume

Cover Letter