$133,800.00-255,200.00 usd; not specified; not spe...
Defect inspection tools
Contamination detection strategies
Real-time data analysis
Drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate and assembly test factories
Job Summary
Drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate and assembly test factories.
Utilize defect inspection tools to detect and resolve process issues, collaborating with teams to improve yield through data analysis and DOE summaries.
Lead efforts to monitor and reduce contamination, ensuring high yield and quality standards while directing next-generation tool installation through major milestones.
Matching Summary
Drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate and assembly test factories.
Salary
$133,800.00-255,200.00 USD; Not specified; Not specified
Skills & Requirements
Must-have
defect inspection tools
contamination detection strategies
real-time data analysis
next-generation tool installation
yield analysis
equipment troubleshooting
Nice-to-have
leading-edge systems development
process integration collaboration
independent leadership
strategic planning
experimental design application
Key Requirements
Bachelor's degree + 5 years semiconductor experience
Master's degree + 2 years semiconductor experience