Samtec, Inc Careers - Principal Optoelectronic Packaging Engineer

Samtec, Inc

Vista, California, United States
Base: $159,000 – $250,000 annually based on locati...
Remote
15-25 years optoelectronic package experience
Advanced packaging architecture development
Automated assembly equipment expertise
Samtec, Inc. is seeking a Principal Optoelectronic Packaging Engineer to lead the design and development of next-generation optoelectronic packaging solutions at their Vista Design Center. The ideal candidate should have extensive experience in optoelectronic packaging and process development, along with a strong background in materials and automated assembly techniques

Job Summary

  • This senior engineering leader role is responsible for designing and implementing next-generation optoelectronic packaging solutions using 2.5D/3D technologies.
  • The position requires extensive experience in research, process development, and transferring scalable manufacturing processes to domestic and international operations.
  • Candidates will receive competitive annual salaries ranging from $159,000 to $250,000 depending on location, plus generous bonuses paid three times per year.

Matching Summary

Match Score: 85

Samtec, Inc. is seeking a Principal Optoelectronic Packaging Engineer to lead the design and development of next-generation optoelectronic packaging solutions at their Vista Design Center. The ideal candidate should have extensive experience in optoelectronic packaging and process development, along with a strong background in materials and automated assembly techniques.

Salary

Base: $159,000 – $250,000 annually based on location; Bonus: Generous bonuses paid February, August, and late fall; Benefits: Medical, dental, vision, 401K match up to 7% plus dollar-for-dollar match on first 5%

Skills & Requirements

Must-have

  • 15-25 years optoelectronic package experience
  • Advanced packaging architecture development
  • Automated assembly equipment expertise
  • Six Sigma DMADV and FMEA methodologies
  • Cleanroom protocols and reliability testing

Nice-to-have

  • Mentoring process development engineers
  • Strong cross-functional collaboration skills
  • Experience with 3D printing polymers
  • Independent problem-solving abilities

Key Requirements

  • BS or MS in Electrical, Materials, Chemical, or Mechanical Engineering
  • 15-25 years of manufacturing environment experience
  • 10+ years conducting research on new materials and processes

Work Rights

Not specified

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