Senior Package Layout Engineer - Hardware

Nvidia Corporation

Multiple Locations
Base: 136,000 usd - 258,750 usd; bonus/equity: equ...
On-site
High-speed asic package implementation
Substrate breakout patterns
Package pinout optimization
Collaborate to implement high speed/density ASIC packages

Job Summary

  • Collaborate to implement high speed/density ASIC packages.
  • Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
  • NVIDIA is widely considered to be one of the technology world’s most desirable employers!

Matching Summary

Collaborate to implement high speed/density ASIC packages.

Salary

Base: 136,000 USD - 258,750 USD; Bonus/Equity: Equity; Benefits: Benefits

Skills & Requirements

Must-have

  • High-speed ASIC package implementation
  • Substrate breakout patterns
  • Package pinout optimization
  • Package routing and placement
  • Design feasibility studies
  • Cadence APD or SiP tools

Nice-to-have

  • HDI designs
  • Virtuoso and Calibre experience
  • Valor usage

Key Requirements

  • B.S. Electrical Engineering or equivalent experience
  • 5+ years experience in PCB Layout
  • Substrate layout experience
  • Cadence APD or SiP and/or PCB layout tools experience
  • High-speed design signal integrity practices

Work Rights

Not specified

Tailored Resume

Cover Letter