Silicon Packaging Engineer - Wireless Communications Solutions

Intel

Hillsboro, Oregon, United States
Base: $141,910.00-200,340.00 usd; bonus/equity: st...
2+ years package assembly technology development
2+ years packaging fea simulations mechanical thermal
2+ years package assembly manufacturing processes hvm ramp
This role drives cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products within Intel's Wireless Communications Solutions team

Job Summary

  • This role drives cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products within Intel's Wireless Communications Solutions team.
  • The successful candidate will lead technology trade-off decisions and oversee end-to-end package development processes from design through high-volume production.
  • Intel offers a competitive total compensation package including stock bonuses and comprehensive benefit programs such as health, retirement, and vacation.

Matching Summary

This role drives cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products within Intel's Wireless Communications Solutions team.

Salary

Base: $141,910.00-200,340.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • 2+ years package assembly technology development
  • 2+ years packaging FEA simulations mechanical thermal
  • 2+ years package assembly manufacturing processes HVM ramp

Nice-to-have

  • Experience working directly with external suppliers OSATs
  • Strong project management capabilities
  • Self-driven with strong problem-solving tenacity

Key Requirements

  • Bachelor's degree in Mechanical/Electrical Engineering or related field plus 4+ years experience
  • Master's degree in relevant field plus 3+ years experience
  • PhD in relevant field plus 1+ years experience

Work Rights

Not specified

Tailored Resume

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